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Microvia

Hemeixin is one of the first companies to provide volume HDI capability to our customers. Our continuous investment in developing world-class fine-line microvia technology has made us a leading microvia board manufacturer in China. Our deep experience and commitment to provide a complete solution for our customers helps to resolve early design issues, shorten lead time, and provide high quality cost effective product. 


 20 sets UV/YAG and over 160 CO2
  laser heads
 ELIC (Every Layer Interconnection)

• Skipped, telescopic, stacked µvias

 30 layers

 Min. microvia - 80µm

 Soldermask Registration: 25µm using
  direct imaging
• 50 um dielectric using 106 prepreg and
  40 um core handling available
 RoHS compliance

 Lead free & Halogen free                                                                                                                              

                                                                                                                                                                                                                                                                                                                                                           

   
 

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