Min.Order : 15 Pieces Quick Quotation >
Item Details
Product Description
Product design, system speed requirements, microprocessor and component scaling, and increased thermal performance are driving advances in PCB technology every day. Hemeixin’s technical and production capability and aggressive technology roadmap has kept pace with these changes and provides a scalable platform for growth.
• Layers (2-64)
• Lines and Spaces (Volume 3/3 Prototype 2/2)
• Controlled Impedance (+/- 10% Standard - +/- 5% Advanced)
• Blind and Buried Vias; Filled via capability
• Buried Capacitance
Dielectric thickness: 14 µm
Capacitance /area: 6.4 nF/in2
Breakdown Voltage: >100V
3M material, no need license
• Buried Resistor
Resistance (ohms/sq.) : 25, 50, 100, 200
• Advanced thermal management and embedded coin technology
• High Performance and Emerging Materials; Halogen free,low loss,ultra-thin,mixed packages, inlay
• Sequential Lamination
• High Tech Drilling Capability – Small hole drilling, Backdrilling
• Mechanical depth control drilling with +/-10um tolerance,min drill
size 0.15mm
• Ultra Fine Pitch (0.8, 0.5, 0.4, 0.3 mm)
Solution
Payment & Shipping
More Product
Recommend Product